Characterization of ultrasonic soldering of Ti and Ni with Ni/Al reactive multilayer deposition
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Abstrakt
The joining of Ti and Ni at low temperatures was analysed in this work. For joining pure Ti and Ni coins of 1.5 mm in thickness were used. Reactive multilayer thin films/foils with nanometric period (bilayer thickness), in particular Ni/Al multilayers, have been used to promote joining in two thickness of 28 and 55 nm. The ultrasonic soldering with SnAgTi active solder has been used for hard-to-solder material. The structural evaluation of soldered joint was studied by optical microscopy and EDX analysis. The structural analysis was focused to the creation of intermetallic layers in the joint interface.
The mechanical properties of solder joints were tested by shear strength.
Pobrania
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Artykuły czasopisma Welding Technology Review (Przegląd Spawalnictwa) publikowane są w otwartym dostępie na licencji CC BY (licencja Creative Commons Uznanie autorstwa 4.0 Międzynarodowe). Licencja CC BY jest najbardziej otwartą dostępną licencją i uważaną za „złoty standard” w formule otwartego dostępu; jest również preferowany przez wielu fundatorów badań. Licencja ta umożliwia czytelnikom kopiowanie i redystrybucję materiału na dowolnym nośniku i w dowolnym formacie, a także zmienianie, przekształcanie lub budowanie na nim materiału, w tym do użytku komercyjnego, pod warunkiem wskazania oryginalnego autora.
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