Main Article Content
The joining of Ti and Ni at low temperatures was analysed in this work. For joining pure Ti and Ni coins of 1.5 mm in thickness were used. Reactive multilayer thin films/foils with nanometric period (bilayer thickness), in particular Ni/Al multilayers, have been used to promote joining in two thickness of 28 and 55 nm. The ultrasonic soldering with SnAgTi active solder has been used for “hard-to-solder” material. The structural evaluation of soldered joint was studied by optical microscopy and EDX analysis. The structural analysis was focused to the creation of intermetallic layers in the joint interface.
The mechanical properties of solder joints were tested by shear strength.
This work is licensed under a Creative Commons Attribution 4.0 International License.
Ministerstvo školstva, vedy, výskumu a športu Slovenskej republiky
Grant numbers VEGA 1/0091/17
Weihs T.P., Fabrication and characterization of reactive multilayer films and foils, in: Barmak K., Cofey K., eds, Metallic Films for Electronic, Optical and Magnetic Applications, Woodhead Publishing, 2014, Cambridge (UK), 160-243.
Ramos A.S., Cavaleiro A.J., Vieira M.T., Morgiel J., Safran G., Thermal stability of nanoscale multilayers. Thin Solid Films, 2014, Vol. 571, 268-274.
Wang J., Besnoin E., Duckam A., Spey S.J., Reiss M.E., Knio O.M., Powers M., Whitener M., Weiss T.P., Room-temperature soldering with nanostructured foils. Applied Physics Letters, 2003, Vol. 83(19), 3987.
Qiu X., Wang J., Bonding silicon wafers with reactive multilayer foils. Sensors and Actuators A: Physical, 2008, Vol. 141(2), 476-481.
Lanin V.L., Activation of melts by the energy of ultrasonic and infrared fields. In Surface Engineering and Ap-plied Electrochemistry, 2010, Vol. 46(5), 469- 476, ISSN 1068-3755.
Ho C.E., Lin Y.W., Yang S.C., Kao C.R., Jiang D.S., Effects of Limited Cu Supply on Soldering Reactions Between SnAgCu and Ni. Journal of Electronic Materials, 2006, Vol. 35(5), 1017-1024.
Liang M.-W., Hsieh T.-L., Chang S.Y., Chuang T.-J., Thin-Film Reactions during Diffusion Soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn Interlayers. Journal of Electronic Materials, 2003, Vol. 32(9), 952-956.
NORO J., Intermetallic phase formation in nanometric Ni/Al multilayer thin films. Intermetallics, 2008, Vol. 16(9), 1061-1065. https://doi.org/10.1016/j.intermet.2008.06.002
RAMOS D., Production of intermetallic compounds from Ti/Al and Ni/Al multilayer thin films – A comparative study. Journal of Alloys and Compounds, 2009, Vol. 484(1-2), 335-340. https://doi.org/10.1016/j.jallcom.2009.04.098
SIMOES S., Anisothermal solid-state reactions of Ni/Al nanometric multilayers. Intermetallics, 2011, Vol. 19(3), 350-356. https://doi.org/10.1016/j.intermet.2010.10.021
TSAO L.C., Direct active soldering of micro-arc oxidized Ti/Ti joints in air using Sn3.5Ag0.5Cu4Ti(RE) filler. Material Science and Engineering: A, 2013, Vol. 565, 63-71.
Choi W.K., Lee H.M., Effect of Ni Layer Thickness and Soldering Time on Intermetallic Compound Formation at the Interface between Molten Sn-3.5Ag and Ni/Cu Substrate. Journal of Electronic Materials, 1999, Vol. 28(11), 1251-1255.