Hodulova E, Ramos AS, Kolenak R, Kostolny I, Simekova B, Kovarikova I. Characterization of ultrasonic soldering of Ti and Ni with Ni/Al reactive multilayer deposition. Weld. Tech. Rev. [Internet]. 2019 Nov. 2 [cited 2024 Dec. 22];91(9):51-7. Available from: https://pspaw.pl/pspaw/article/view/1073