Hodulova, E., A. S. Ramos, R. Kolenak, I. Kostolny, B. Simekova, and I. Kovarikova. “Characterization of Ultrasonic Soldering of Ti and Ni With Ni/Al Reactive Multilayer Deposition”. Welding Technology Review, vol. 91, no. 9, Nov. 2019, pp. 51-57, doi:10.26628/wtr.v91i9.1073.