Hodulova, E., Ramos, A. S., Kolenak, R., Kostolny, I., Simekova, B., & Kovarikova, I. (2019). Characterization of ultrasonic soldering of Ti and Ni with Ni/Al reactive multilayer deposition. Welding Technology Review, 91(9), 51–57. https://doi.org/10.26628/wtr.v91i9.1073